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P 1. P must be used in combination with other acid copper intermediates to provide brightening deposit. 2. Too low P in baths can reduce brightness and leveling. Too high P in baths can remarkably reduce the adhesion. |
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MBT 1. MBT has good effects on acid copper plating baths and serves as a fine leveling agent for middle and low current density areas. 2. It could provide a high-degree brightening deposit which is good in leveling within a wide range of temperature. |
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AEO 1. As the leveling agent for LCD areas in acid copper baths, AEO remarkably ameliorates the brightening degree and leveling feature when added into the baths. 2. It is usually used in combination with SP, M or GISS. |
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MT-580 1. Proper amount of MT-580 could effectively prevent the appearance of pores. It does well in leveling. 2. There is no hydrophobic membrane on the surface of deposit. It can effectively curbs the decomposition of brightener and elevates the stability of baths. 3. It is a fine carrier for the dye-based and non dye-based brighteners. It could totally replace polyethylene glycol (PEG). |
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MT-880 1. MT-880 is a kind of low¨Cfoam acid copper wetting agent which effectively prevents the emergence of pores, and it has excellent leveling and throwing power. 2. There is no hydrophobic membrane on the surface of deposit. It effectively curbs the decomposition of brightener and elevates the stability of baths. 3. The effects would be even better if MT-880 is used in combination with dye-based brighteners. |
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