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QT QT

In normal sulphate nickel plating bath, >20mg/L copper impurity can deteriorate the nickel deposit and cause blackening in LCD areas. Compared with low current electrolyzing or raising pH to subside, QT saves a lot of time and nickel. If adding QT 0.2-0.4g/L into bath once a month or ahead of treating nickel-plating bath, the problem of darkening or blackening caused by excessive copper impurity can be resolved. It's a stable, reliable, fast and effective way to maintain the stability of nickel-plating bath.
QF QF

>50mg iron ion in nickel-plating baths can cause burns or pores. Adding QF into bath can remove iron impurities. Electrolyzing or filtration is needless. QF is quite suitable for nickel-plating on steel pipes.
Usage: adding 0.1g/L QF into the bath, 80mg iron ion can be removed.
TCA TCA

It is a agent to improve the potential difference, which can remove the active sulfate in half bright baths.
ATPN ATPN

1. ATPN is a bath purifier, which can purify bath and improve the throwing power in LCD areas.
2. ATPN can be dissolved in the water, but excessive use may reduce the brightness of deposit.
ATP ATP

1. ATP is a bath purifier, which can purify bath and improve the throwing power in LCD areas.
2. ATP can be dissolved in the hot water, but excessive use may reduce the brightness of deposit.
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